The Global Semiconductor Packaging Market anticipated to generate a Revenue of $52,271.6 Million, Growing at a CAGR of 7.0% from 2021 to 2028 - Research Dive

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The global semiconductor packaging market is projected to be valued at $52,271.6 million by 2028, surging from $30,814.7 million in 2020, at a noteworthy CAGR of 7.0%.

Impact Analysis of COVID-19 on the Semiconductor Packaging Market

The Covid-19 impact on semiconductor packaging market has been negative. The restrain in the global industrial production due to imposed lockdowns across the globe in the semiconductor industry has disturbed the global supply chain of raw materials and components such as organic substrate, bonding wire, lead frame, ceramic package, die attach material and others required in semiconductor manufacturing. In addition to this, the reduction in the overall demand of semiconductor-based products such as consumer electronics and automobiles and reduced expenditure in the electronics goods are expected to aid the growth of this sub-segment.

Moreover, during the time of pandemic, companies have been analyzing shifts in product demand volumes and revising product schedules to meet immediate needs of the customers. Implementing AI-supported cash management and emphasizing on planning and scenario modelling to mitigate the Covid-19 impact on semiconductor packaging market has proven to be helpful for the industry. These factors are expected to positively impact the market.

Global Semiconductor Packaging Market Analysis

The surge in the implementation of technologies such as (IoT) Internet of Things and artificial intelligence (AI) in the sectors such as construction, automobiles, mining, healthcare, robotics and others for electronic devices that are compatible and capable of carrying out advance computing operations is expected to increase the semiconductor packaging market size. In addition to this, increasing government initiatives across the world are also aiding the growth of the market; for instance, in year 2020 "Scheme for Promotion of Manufacturing of Electronic Components and Semiconductors” (SPECS)" launched by the government of India, provides financial incentive of 25% on capital expenditure for electronic goods that comprise downstream value chain of electronic products such as electronic components, semiconductor/display fabrication units, for promotion of semiconductor packaging in the country. Initiatives like these are expected to positively impact the market. These factors are expected to contribute in the growth of global semiconductor packaging market share.

The high capital requirement for full-fledged semiconductor fabrication plants, that provide semiconductor packaging service as per the requirement by different industries such as consumer electronics, automotive, healthcare, IT & telecommunication, aerospace & defense, and others may affect the global semiconductor packaging market share.

The growing implementation of 3d semiconductor packaging technology is anticipated to open new scope of opportunities for semiconductor packaging market growth. The 3d semiconductor packaging has advantages such as being compact, easy to assemble as the number of components gets reduced, low in cost and others. In addition to this, high rate of utilization of semiconductor-based goods in the developing countries such as India, Vietnam and others is expected to open new scope of opportunities for semiconductor packaging market growth.

Global Semiconductor Packaging Market, Segmentation

The global semiconductor packaging market is segmented based on packaging platform, packaging material, end-user, and region.

Packaging Platform:

The platform segment is further classified into flip chip, embedded die, fan-in wafer-level package, fan-out wafer-level package, and 3D stacking. Among these, the 3D stacking sub-segment is expected to have the fastest growth and surpass $9,530.9 million by 2028, with an increase from $3,749.4 million in 2020.

The growing demand for compact and cost-effective technology in semiconductor manufacturing is anticipated to open new scope of opportunities for 3D stacking subsegment in the forecast period. Companies operating in the semiconductor packaging sector are implementing strategies such as collaboration; for instance, in June 2021, Presto Engineering, a French Application-specific integrated circuit (ASIC) design and outsource operations provider, and Cadence Design Systems, Inc., an American multinational computational software company headquartered in California, collaborated to broaden semiconductor package design solutions and work on high-performance system-in-package (SiP) development for the automotive and industrial IoT markets. These factors are expected to positively impact this sub-segment in the forecast period.

Packaging Material:

The packaging material segment is further classified into organic substrate, bonding wire, lead frame, ceramic package, die attach material, and others. Among these, the ceramic package sub-segment is expected to have the fastest growth and surpass $6,496.1 million by 2028, with an increase from $3,497.6 million in 2020.

Ceramic packaging is the semiconductor packaging process using inorganic and nonmetallic materials. The increasing use of ceramic packaging in the automotive industry due to increased implementation of electronics systems which require semiconductor packaging in applications such as airbag assemblies, semiconductors, printed circuit boards, microchips, micro-electro-mechanical systems, autonomous cruise control, and automatic emergency braking in automobiles is expected to aid the growth of this sub-segment

End-user:

The end-user segment is further divided into consumer electronics, automotive, healthcare, IT & telecommunication, aerospace & defense, and others. The consumer electronics sub-segment is projected to have a dominating market share in the global market and register a revenue of $15,826.2 million during the forecast timeframe.

Increased investments in research and development of products equipped with latest technologies are predicted to boost the market growth; for instance, in January 2021, South Korean company, Samsung launched products like Samsung Bespoke 4-Door Flex refrigerator, 110-inch MICRO LED television, and JetBot 90 AI vacuum cleaner. These consumer electronic equipment reflect the development in the research and development in the field of consumer electronics.

Region:

The semiconductor packaging market for the Asia-Pacific region generated a revenue of $11,389.6 million in 2020 and is further projected to reach up to $19,078.5 million by 2028. The surge in consumer electronics production due to rise in per capita income in the Asia-Pacific region and increased expenditure on consumer electronics equipment such as portable digital assistants, audio devices, and others are anticipated to foster the growth of the market in the region. In addition to this, major presence of semiconductor producing countries such as China, Japan, Taiwan and others in the region is expected to aid the growth of semiconductor packaging market.

Key Players in the Global Semiconductor Packaging Market

Some of the leading global semiconductor packaging market players are –

1. 3M
2. Intel Corporation
3. Applied Materials, Inc
4. SÜSS MICROTEC SE
5. Microchip Technology Inc.
6. Amkor Technology Inc.
7. Advanced Semiconductor Engineering, Inc.
8. GlobalFoundries U.S. Inc.
9. Taiwan Semiconductor Manufacturing Company Limited
10. SPTS Technologies Ltd.

Along with the company profiles of the key players in the market, the report includes the Porter’s five forces model that gives deep insights into the competitive environment of the market.

Porter’s Five Forces Analysis for the Global Semiconductor Packaging Market:

• Bargaining Power of Suppliers:. There are moderate number of suppliers in the semiconductor packaging market. Across the world there are different organizations working in the field of semiconductor packaging to get a competitive edge in the market.
  Thus, the bargaining power suppliers is moderate.
• Bargaining Power of Buyers: The buyers in market have moderate bargaining power, therefore the suppliers in the semiconductor packaging market focus on providing superior quality services in a cost-effective manner.
  Thus, the bargaining power of the buyers is moderate.
• Threat of New Entrants: The companies that entering in the semiconductor packaging market emphasize on innovation for reducing the cost of production. The capital requirement in semiconductor packaging market is high. 
  Thus, the threat of the new entrants is low.
• Threat of Substitutes: The semiconductor packaging process is essential and currently there is no alternative process of semiconductor packaging.
  Thus, the threat of substitutes is low.
• Competitive Rivalry in the Market: There is a highly competitive rivalry between companies in the semiconductor packaging market. including Advanced Semiconductor Engineering, Inc. and Taiwan Semiconductor Manufacturing Company Limited 
  Therefore, competitive rivalry in the market is high.