Quad-Flat-No-Lead Packaging Market Size to Generate $1,063 Mn by 2031

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The Global Quad-Flat-No-Lead Packaging Market Share is predicted to be valued at $1,063 million by 2031, surging from $453.1 million in 2021, at a noteworthy CAGR of 8.8%.

Impact Analysis of COVID-19 on the Quad-Flat-No-Lead Packaging Market

The COVID-19 pandemic started in early 2020, and in the second quarter, it expanded to its full capacity. As a result, demand for quad-flat-no-lead technology decreased due to a decline in demand from the semiconductor manufacturing industry due to the rise in the COVID-19 pandemic various governments around the globe-imposed restrictions such as lockdowns and social distancing norms impacted the manufacturing of semiconductors. the semiconductor market was hesitant to estimate the year-over-year growth of global semiconductor demand. The market has seen a decrease in the need for materials, but beginning in the second half of 2020, the demand for remote technologies saw a rise. It has raised the demand for zero-contact and home-based pandemic prevention strategies, including home economics, homework, and online learning. Because of the development of terminal devices (such as NB, tablets, and game consoles), as well as NetCom equipment (such as servers, SSDs, and network switches), which has increased sales, the demand for packaging materials on a global scale has not dropped but rather increased.

Global Quad-Flat-No-Lead Packaging Market Analysis

A reducing lead inductance caused by ideally short bond wires, light weight, a thin profile, and a compact "near chip scale" footprint are all advantages of QFNs. Many novel applications that require higher performance in terms of size, weight, and thermal & electrical qualities are ideal for the QFN package. The potential drawbacks of using QFN packaging include the possibility of a thermal pad floating in a puddle of hot solder during assembly, problems with chip contact pads oxidizing, and a lack of clearance for a soldering pencil to reach pads underneath the chip for touch-up work. Better reflow process control and the use of QFNs that are plated (tin common) to reduce oxidization problems can both help to mitigate these problems.

Although these innovative devices have many advantages, they also raise some serious manufacturing and reliability issues. Assemblers are frequently reluctant to accept this new technology because of flaws like shorts, voids, gaps, and inadequacies. Although the QFNs design has several enticing qualities, it is prone to voiding on the ground pad. The difficulty of vacuum generation increases when combined with a lead-free procedure.

Vehicle electronics, automotive electronic control units (ECUs), and 5 G-related application modules will be the key sources of packaging materials' future growth momentum. Maximum usable frequency (MUF) materials are primarily utilized in the packaging of AP (Application Processor) and BB (Baseband Processor) devices. The future need for MUF materials will rise as a result of rising Flip-chip-scale-packaging FC-CSP packaging import demand for dynamic random-access memory (DRAM) and market demand for Antenna in package (AiP) and system in package (SiP) packaging, which will give the market demand for MUF materials still another boost. The price of MUF will increase as the silica filler's particle size decreases. MUF particle size (20 m) costs around three times as much as particle size (30 m). These factors of quad-flat-no-lead technology such as small size and less price compared to other leadless packaging technology is anticipated to boost demand for quad-flat-no-lead market opportunity.

Global Quad-Flat-No-Lead Packaging Market, Segmentation

The global quad flat no lead packaging market is segmented based on type, moulding method, terminal pads, industry vertical and region.

Type:

The type segment is further classified into air-cavity QFN, plastic-moulded QFN, and others. Among these, the air-cavity QFN sub-segment accounted a dominant market share in 2021. A variety of applications call for air cavity packaging. Air cavity packaging is ideal since many Microelectromechanical System (MEMS) devices cannot work when implanted in epoxy. Free space optical and imaging equipment cannot have an opaque, light-diffracting substance around it. Many sensors must detect their surroundings in order to work, as opposed to being enclosed within a solid piece of material. It is anticipated to boost the air cavity QFN market demand in the manufacturing of microelectromechanical system devices.

Moulding Method:

The moulding method segment is further classified into punched and sawn. Among these, the punched sub-segment is accounted to show dominant market share in 2021. QFN is typically supported by higher volume production, whereas punch type is frequently encountered with lower volume goods. Both have electrical and thermal characteristics that are fairly similar. In punch type the package is moulded into single mold cavity format and separated by the punch. The naming is based on the singulation technique, in which a punch tool is used to separate punched QFNs from one another and a saw is used to cut vast quantities of packaging into smaller pieces to separate QFNs.

Terminal Pads:

The terminal pads segment is further classified into fully exposed terminal ends, pull-back terminal ends, and side wettable flank terminal ends. Among these, the fully exposed terminal ends sub-segment is anticipated to have a dominant market share in 2021. In fully exposed terminal type exposed terminals can be viewed from the bottom of the box, and the terminal ends are exposed all the way to the package's edge. The lead ends are completely visible on the package's side. It's conceivable for a solder fillet to fail if the terminal end is adequately moistened, and is created up the side of the component. The exposed terminal ends provide better thermal dissipation when compared to other packaging.

Industry Vertical:

The industry vertical segment is further classified into consumer electronics, industrial, automotive, computing/networking, and communications. Among these, the automotive sub-segment is accounted to show dominating market share in 2021. Due to the growing demand for automation and better performance in automobiles, the integrated circuit packaging industry's current automotive business has expanded dramatically. Cars will be able to be more dependable and intelligent due to improvements in the automotive industry. The quad-no-flat-lead packaging industry is reorienting its priorities to give the creation of cutting-edge packages for the needs of the next-generation automotive in order to meet the increasingly complicated demands of the automotive industry.

Region:

The quad flat quad-flat-no-lead packaging market in the Asia-Pacific region is projected to show the fastest growth. Due to its fast industrialization, the Asia Pacific region is seeing strong economic growth. Huge foreign direct investment FDI is flowing into the region as a result of the friendly government policies in nations like China and India. Due to the affordable availability of production-related inputs in this area, the leading firms are setting up their manufacturing facilities. China and India are increasingly serving as the center of the world's electronic device manufacturing Major investments in no-lead packaging material are being made in China, which is have the biggest potential in the Asia-Pacific region. For instance, in January 2022, JCET Group, a leading global provider of IC backend manufacturing and technology services, recently announced the packaging of 4nm chips for mobile phones, as well as the combined packaging of computer central processing unit, and graphics processing unit chipset.

Key Players in the Global Quad-Flat-No-Lead Packaging Market

Some of the leading quad flat no lead packaging market players are

• Amkor Technology Inc.
• Texas Instruments Incorporated
• Microchip Technology Inc.
• STATS ChipPAC Pte Ltd
• ASE
• NXP Semiconductors
• JCET Group
• Powertech Technology Inc.
• Tianshui Huatian Technology Co. Ltd
• ChipMOS TECHNOLOGIES INC.